Low Contact Wafer Transfer 76mm – 200mm
Tabletop, automatic high-value, thin wafer, compound wafer transfer tool. Wafers are gently bulk-lifted midpoint in the cassette slots before being extracted or loaded. This is to minimize contact with the cassette, eliminating chances of particulation or wafer edge chipping. High reliability and low maintenance. Small footprint saves valuable cleanroom space. Designed for ISO Class 3 (FS209E Class 1); Antistatic construction; Specify cassette model number(s) with order.
Product
Description
Tabletop, automatic high-value, thin wafer, compound wafer transfer tool. Wafers are gently bulk-lifted midpoint in the cassette slots before being extracted or loaded. This is to minimize contact with the cassette, eliminating chances of particulation or wafer edge chipping. High reliability and low maintenance. Small footprint saves valuable cleanroom space. Designed for ISO Class 3 (FS209E Class 1); Antistatic construction; Specify cassette model number(s) with order.
- Touchscreen control
- PVDF coated rods transfer 25 wafers at one time.
- Door present detection
- Wafer detection in cassette and in tool.
- Designed for ISO Class 3
H-Square uses a Return Material Authorization (RMA) process. If you need to return a product, contact us at info@h-square.com to receive an RMA number. Please state name, product part number and reason for return. Once you receive the RMA number, ship the product back to H-Square. Customer is responsible for shipping costs to return product.
- If the product is being returned under warranty as defective, it will be repaired or replaced at no charge after evaluation.
- If product is being returned unused and unopened within 30 days, a full refund will be offered, less original shipping charges.
- If the product is being returned used within 30 days, product will be evaluated for condition and customer refunded accordingly.
- Products over 30 days cannot be returned for refund.