Bulk Horizontal Wafer Transfer 300mm
Tabletop, automatic FOUP to FOSB wafer transfer tool. Wafers are mapped, then gently bulk-lifted in the cassette; minimizing contact with the cassette and eliminating the chances of particulation, abrasion, or wafer edge chipping. High reliability and low maintenance . Small footprint saves valuable cleanroom space. Antistatic construction; Specify cassette model number(s) with order.
Product
Description
Tabletop, automatic FOUP to FOSB wafer transfer tool. Wafers are mapped, then gently bulk-lifted in the cassette; minimizing contact with the cassette and eliminating the chances of particulation, abrasion, or wafer edge chipping. High reliability and low maintenance . Small footprint saves valuable cleanroom space. Antistatic construction; Specify cassette model number(s) with order.
- Touchscreen control
- FOUP to FOSB
- Mapping feature checks for cross slot, double stack and wafer presence.
- PVDF coated rods transfer 25 wafers at a time
- Designed for ISO Class 3
H-Square uses a Return Material Authorization (RMA) process. If you need to return a product, contact us at info@h-square.com to receive an RMA number. Please state name, product part number and reason for return. Once you receive the RMA number, ship the product back to H-Square. Customer is responsible for shipping costs to return product.
- If the product is being returned under warranty as defective, it will be repaired or replaced at no charge after evaluation.
- If product is being returned unused and unopened within 30 days, a full refund will be offered, less original shipping charges.
- If the product is being returned used within 30 days, product will be evaluated for condition and customer refunded accordingly.
- Products over 30 days cannot be returned for refund.