An edge-grip normally closed (consistent force) edge exclusion mechanical pick for handling round substrates from the wafer edge. The wafer contact pad is a per-fluorinated O-ring strip for
grip/hold on the wafer without scratching or leaving out-gassing behind. The knife-edge gripper is replaceable. Commonly used where double-sided wafers are being handled also in application labs and for wafer rescue applications.
The MCP2-23-S Features:
|Wafer Size||50, 76|
|Dimensions||7.2" x 1.4" x .7"|
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