Automation compatible 25-slot all T6061 aluminum construction thermal process cassette used in semiconductor manufacturing operations worldwide. 300mm SEMI compliant design attributes. Weight reduction architecture with side handles for operator ergonomic comfort and safety. Features wafer retaining lock bar to prevent wafers from sliding out during transport. Hard clear (HC) anodization surface fi nish. All welded construction to reduce thermal expansion/contraction issues and preserve dimensional stability. Designed for ISO Class 3 (FS209E Class 1) Thermal environments up to 350° C. Weight:7.2 lbs. (3.2kg)