Thinning of an IC chip improves the total efficiency, as it allows a more efficient cooling, faster speed and,as an added benefit, the design of
smaller form factor devices. H-Square can build on its extensive experience in thin wafer handling technology to support its customer's
requirements. Thin wafer handling capabilities generally enable the handling of wafers during and after backside grinding, where the substrate
Thinning of an IC chip improves the total efficiency, as it allows a more efficient cooling, faster speed and, as an added benefit, the design of
smaller form factor devices. H-Square can build on its extensive experience in thin wafer handling technology to support its customer's
requirements. Thin wafer handling capabilities generally enable the handling of wafers during and after backside grinding, where the substrate is
thinned down to the single digit micrometer scale. H-Square has developed thin wafer handling products for every type of substrate. Our unique
thin wafer handling transfers, aligners, vacuum wands, presenters and cassettes are in use at our customer sites around the globe.
MISC1400 OFFSET THIN WAFER VACUUM WAND
150mm, 200mm and 300mm ESD safe thin wafer vacuum wand. Horizontal offset
"Hoop Style" for supporting 80µ - 250µ thin inverted wafers from backside.
Material: T7071 aluminum with PFA coating. Ships complete with end effector tip,
NO3AS1 wand handle, CC11SDS coil cord, and HSU3PT wand holder
MISC1400-004 for handling 200mm and 300mm
thin wafers
MISC1400-008 for handling 150mm and 200mm
thin wafers
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MISC1400 STRAIGHT THIN WAFER VACUUM WAND
200mm and 300mm ESD safe thin wafer vacuum wand. Straight "Hoop Style" for
supporting 80µ - 250µ thin wafers from the backside. Material" T7071 aluminum
with PFA coating. Ships complete with end effector tip, NOASPF2 wand handle,
CC11SDS coil cord, and HSUPT wand holder
MISC1400-006 for handling 200mm and 300mm thin wafers
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300mm "U" SHAPED THIN WAFER VACUUM WAND
300mm ESD safe thin wafer vacuum wand. Backside supporting vacuum wand end
effector for handling 80µ - 250µ thin wafers. Material is T7071 aluminum with HCP
coating. Ships complete with end effector tip, NO3AS1 wand handle, CC11SDS
coil cord, and HSU3PT wand holder
NO3T3-001 for handling 300mm thin wafers
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200mm TAIKO STYLE WAFER VACUUM WAND
ESD safe PEEK vacuum wand assembly for handling TAIKO and MEMS style
wafers from the edge exclusionary area.
NO3T3PKAS-007 for handling 200mm thin wafers with 4mm edge
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OFFSET 300mm THIN WAFER TIP/WAND ASSEMBLY
45 degree angle horizontal offset ESD safe PEEK thin wafer handling wand/tip
assembly. Recommended for 220µ - 350µ thick 300mm wafers.
NO3T3PKAS-008 for handling 300mm thin wafers
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300mm THIN WAFER TIP
300mm ESD safe PEEK thin wafer tip. Recommended for 220µ - 350µ thick
300mm wafers. Compatible with standard NO3AS1 standard vacuum wand.
T3PKAS1-001 for handling 300mm thin wafers.
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T791PKAS 50mm-75mm ESD safe PEEK thin
wafer vacuum tip
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T792PKAS 75mm-100mm ESD safe PEEK
thin wafer vacuum tip
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T794PKAS 100mm-150mm ESD safe PEEK
thin wafer vacuum tip
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T693PKAS3-001 75mm-200mm ESD safe
PEEK thin wafer vacuum tip
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T693PKAS2D-001 75mm-200mm ESD safe
PEEK thin wafer vacuum tip - 20 degree
bend down
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Recommended ESD safe vacuum set -
vacuum tip, plus NOASPF2 wand, HSU holder
and CC11SDS coil cord
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Copyright © 2015 - H-Square Corporation Santa Clara, California, USA All Rights Reserved
MISC1700 SERIES - THIN WAFER FOUP INSERT KITS
Custom FOUP insert kits for supporting 300mm thin wafers in a FOUP. Unique Patent
Pending all welded stainless steel wire designs available for several industry standard
FOUP carriers. Available with either antistatic PEEK coating or PFA Teflon coating.
Please contact H-Square sales for product ordering part numbers
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LCT - LOW CONTACT TRANSFER SYSTEMS
Semiautomatic ESD safe thin wafer low contact transfer. Custom programming for thin
wafer transfer applications. Gently transfers wafers from cassette to cassette for the
most critical areas including back-grinding operations. Optional H-Bar up compatibility
for reorientation wafers 180 degrees. Six programming and mechanical safeguards to
protect wafers during transfer operations.
LCTAS6 150mm thin wafer transfer system
LCTAS8 200mm thin wafer transfer system
LCTAS12 300mm thin wafer transfer system
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WT HORIZONTAL WAFER TRANSFER - THIN WAFER
ESD safe 200mm thin wafer slide transfer for 200µ -350µ thin wafers.
Transfer arm has three point contact to prevent thin wafers from “rolling”
Design reduces the abrasion of sharp thin wafers against the inside slot of the cassette
which will lead to edge chipping when the cassette is damaged.
Transfer features cassette height adjustment risers to correct for slot alignment issues
as most wafer cassette slots are designed for standard thickness wafers.
WT28HAS-022 200mm thin wafer transfer system
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FUJI BAKELITE THIN WAFER BI PITCH CASSETTES
ESD safe 150mm and 200mm bi-pitch 13 slot COC plastic thin wafer cassettes.
Features wide slots and extended wafer supports to aid in keeping thin wafers flat for
robotic process applications. Available with or without handles. Compatible storage
boxes are available.
FB20A106H01 200mm thin wafer bi-pitch plastic cassette, with handle
FB20A106H02 200mm thin wafer bi-pitch plastic cassette
FB15A101H01 150mm thin wafer bi-pitch plastic cassette, with handle
FB15A101H02 150mm thin wafer bi-pitch plastic cassette
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MC12 SERIES 300mm ALUMINUM THIN WAFER CASSETTE
300mm all welded aluminum bake cassette. Lightweight ergonomic design minimizes
weight and potential for operator fatigue. Made from aluminum to provide dimensional
stability over time and temperature changes. Features SEMI standard kinematic
coupling positioners and info pad. Transfer compatible with all FOUP and FOSB
Cassette features wafer retaining lock-bar for safe transportation of wafers in a
horizontal wafer position.
MC12-13HC 300mm thin wafer bake cassette
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SSC THIN WAFER STAINLESS STEEL CASSETTES
For high temperature wafer bake-out applications or specialty applications, including
megasonic and cleaning processes. All welded 316SST electro-polished construction.
Outside dimensions are similar to SEMI standard plastic process carriers. Transfer and
automation compatible. Light Weight: Standard SST 200mm cassette ~2.5lbs.
Temperature: maximum recommended continuous operating temperature without
causing distortion is 550º Celsius. Corrosion Resistance: 316SST offers better
resistance than 302 and 304 SST; resists many industrial chemicals and solvents
including: sodium and calcium brines, hypo chlorite solutions, phosphoric acid, sulfite
liquors, and sulfurous acids. Standard cassettes are designed for 75mm, 100mm,
125mm, 150mm and 200mm, 25-slot wafer configurations. Non standard 10-slot,
12-slot, 13-slot, 26-slot and 28-slot cassettes, as well as carriers for square substrates
and other non-standard diameters and wafer thicknesses are available upon request.
Please contact H-Square sales for product ordering part number
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EZ GUIDE THIN WAFER NOTCH AND FLAT FINDERS
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Thin Wafer
Handling Products
Handling Tools for the Electronics Industry
