For moving single 300mm wafers between two SEMI standard FOUP, FOSB or
H-Square MC12-25HC metal bake-out cassettes.Economical - Targeted for cost
sensitive applications: R&D, Test-Assembly-Packaging & Application Labs.  Low
Selling Price. Simple - Compact portable design for sorting wafers between two
SEMI standard FOUP, FOSB or Metal Bake-out Carriers. Operator opens FOUP
manually, rotates into position. User-friendly FPD touch screen software - select
recipe or manual mode to move a single or multiple wafers between carriers.
Safe -300mm edge contact grip end-effector includes wafer mapping sensor
which detects wafers and checks for double stack & cross slotting.This system
does not offer load ports, OCR or alignment capabilities.
Wafer Movers - Single Wafer Transfers
H-Square’s Automatic Wafer Mover™ (AWM) is an electromechanical stand-
alone tabletop automation system designed to move single wafers between two
process cassettes.  The automation platform is controlled by use of a storable
touchscreen display. The AWM can be ordered from the factory adjusted to
handle either 3" (76mm), 100mm, 150mm or 200mm wafers.  Each system can
be uniquely setup to handle customer specific wafer cassette(s), wafer thickness
or unique wafer attributes.  Wafer Movers are designed to alleviate the need for
manual wafer handling methods, reduce scratching and wafer breakage.  An H-
Square Wafer Mover platform will effectively replace the need for a vacuum
wand, wafer tweezers, or an expensive sorter platform.User friendly FPD touch
screen software allows an operator to easily select Recipe Mode or Manual
Mode.  Recipe Mode allows operator to select preprogrammed recipes wafer
movements between two carriers.  Manual Mode allows operator to choose on
the screen which wafers to move and where they should be placed. A safe
vacuum-less low contact end-effector includes a wafer mapping  sensor which
maps wafer locations in each cassette and detects wafers presence for safe
accurate movements.
Automation & Wafer Handling Tools for the Electronics Industry
Product Part Number:
Product Family:
Wafer Size
Footprint Dimensions:
Height:
Gross Weight:
Antistatic Construction:
Power Input:
Power Output:
Specification:
Video:
WS300M
Wafer Mover, Automation
300mm
51.7" wide x 35.8" deep (1567mm x 909mm)
61.1" (1551mm)
lbs (kg)
Yes
120V-240V AC
24V
Product Part Number:
Product Family:
Wafer Size:
Footprint Dimensions:
Height:
Gross Weight:
Antistatic Construction:
Power Input:
Power Output:
Specification:
Video:
AWM2
Wafer Mover, Automation
200mm, 150mm, 100mm, or 3"
18.6" x 30.0" (472mm x 762mm)
31.1" (789mm)
82 lbs (37.1kg)
Yes
120V-240V AC
24V