PART NUMBER
DESCRIPTION
MATERIAL
NOASPF2
WAND HANDLE
ESD Safe PVDF
T791PKAS
VACUUM TIP
ESD Safe PEEK
CC9SDS
COIL CORD
ESD Safe Polyurethane
CTA12
GROUND ADP
Stainless Steel
HSU
HOLDER
White Polypropylene
100mm Vacuum Wands
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100mm Vacuum Wand Set - ESD safe, cassette to cassette handling
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wand handling brochure
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lead time and pricing
Vacuum Tips - cassette-to-cassette 100mm wafer handling

T791PKAS
Material: injection molded antistatic PEEK
Thin Wafer / Compound Semiconductor materials
50mm-100mm
Recommended vacuum wand: NOASPF2
Also available in bent angles up/down

T794PKAS
Material: injection molded antistatic PEEK
Thin Wafer / Compound Semiconductor materials
50mm-150mm
Recommended vacuum wand: NOASPF2
Also available in bent angles up/down

T691PKAS
Material: injection molded antistatic PEEK
General usage, 50mm - 100mm
Recommended vacuum wand: NOASPF2
Also available in bent angles up/down
Vacuum Tips - cassette-to-platen/susceptors toolsets 100mm wafer handling
T75033QV
Designed for high temperature applications. Wafer holding
area is made of quartz, which is continuously usable to
1425C. Vespel pick up withstands 480C on a short-
term basis. Vespel surrounds quartz to protect it from
damage. Knife-edged spatula facilities pick up of wafers
from flat surfaces. Ideal for removing wafers from epitaxial
reactors and other high temperature processes.
T75072PKAS
An ESD safe  PEEK special application tip for general
handling of fragile wafers, such as Gallium Arsenide, of up
to 4”. Grooved pocket provides excellent adhesion to
wafers with minimum distortion. Knife-edge tip allows
removal of wafer from flat surfaces such as platens and
susceptors.
T75072V
A high temperature Vespel special application tip for
general handling of fragile wafers, such as Gallium
Arsenide, of up to 4”. Grooved pocket provides excellent
adhesion to wafers with minimum distortion. Knife-edge tip
allows removal of wafer from flat surfaces such as platens
and susceptors.
T75049V
A high temperature Vespel knife-edged tip for
loading/unloading of wafers up to 4” from platens and
susceptors. Designed for handling silicon wafers, Use
T75072V for Compound Semi materials
T75070V
A high temperature Vespel narrow, knife-edged tip for
loading/unloading wafers up to 4” from stages offering
limited access. Vacuum pocket side has minimal angle to
allow wand to remain relatively parallel to wafer and
stage
Uses NOASPF2 (PRESS FIT CONNECTION) Wand handle (normally open), Shut off holder, Coil Vacuum Cord
and a grounding adapter.
Uses NOASQ2 (QUICK LOCK CONNECTION) wand handle (normally open), shut off holder, coil vacuum cord and
a grounding adapter.
PART NUMBER
DESCRIPTION
MATERIAL
NOASQ2
WAND HANDLE
ESD Safe PVDF
see below
VACUUM TIP
see below
CC9SDS
COIL CORD
ESD Safe Polyurethane
CTA12
GROUND ADP
Stainless Steel
HSU
HOLDER
White Polypropylene
←CLICK HERE to have a sales
representative contact you with vacuum
wand specifications, lead time and
pricing
Automation & Wafer Handling Tools for the Electronics Industry
Automation & Wafer Handling Tools for the Electronics Industry